Intermetallic Compound Growth, Hardness and Corrosion Properties of SAC305/Cu Solder by Microwave Hybrid Heating

C.C. Chang; M.F. Mohd Nazeri; M.A.F.M. Mukhtar; A. Alshoaibi; Y. Tabak; A. Evcin; F. Hussain; A.A. Mohamad

doi:10.24425/amm.2025.156240

Authors

C.C. Chang Universiti Sains Malaysia, Energy Materials Research Group (EMRG), School of Materials and Mineral Resources Engineering, Pulau Pinang, Malaysia https://orcid.org/0009-0001-8642-7691
M.F. Mohd Nazeri https://orcid.org/0000-0003-4923-0184
M.A.F.M. Mukhtar Universiti Sains Malaysia, Energy Materials Research Group (EMRG), School of Materials and Mineral Resources Engineering, Pulau Pinang, Malaysia https://orcid.org/0000-0002-3656-3783
A. Alshoaibi King Faisal University, Department of Physics, College of Science, Al-Hassa, Hofuf 31982, Saudi Arabia https://orcid.org/0000-0002-9548-6503
Y. Tabak TUBITAK National Metrology Institute (TUBITAK UME), Kocaeli 41470, Türkiye https://orcid.org/0000-0002-4912-8828
A. Evcin Afyon Kocatepe University, Department of Materials Science and Engineering, Afyon 03200, Türkiye https://orcid.org/0000-0002-0163-5097
F. Hussain NED University of Engineering and Technology, Department of Materials Engineering, Karachi 75270, Pakistan https://orcid.org/0000-0002-4337-7006
A.A. Mohamad Universiti Sains Malaysia, Energy Materials Research Group (EMRG), School of Materials and Mineral Resources Engineering, Pulau Pinang, Malaysia https://orcid.org/0000-0001-5525-7100

DOI:

https://doi.org/10.24425/amm.2025.156240

Abstract

Tin-silver-copper (Sn-3.0Ag-0.5Cu, SAC305) in the form of SAC305/Cu joint were compared under different reflowing conditions; conventional reflow (CR) and microwave hybrid heating (MR). The results showed that both reflow methods produced an interfacial and primary intermetallic compound (IMC) layer, specifically η-Cu6Sn5, which contributed to increased sample hardness. However, extended MR reflow times led to the formation of ɛ-Cu3Sn, which could potentially reduce solder joint reliability. Notably, after exposure to corrosion, the samples exhibited minimal pitting, indicating enhanced corrosion resistance following MR reflow. This improvement is likely due to the more prominent IMC presence in MR compared to CR.

Intermetallic Compound Growth, Hardness and Corrosion Properties of SAC305/Cu Solder by Microwave Hybrid Heating

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Intermetallic Compound Growth, Hardness and Corrosion Properties of SAC305/Cu Solder by Microwave Hybrid Heating

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