Impact of Bismuth as Microalloying Element in Sn-0.7Cu Lead-Free Solder Alloys

Authors

  • N.S.M. Zaimi Universiti Sains Malaysia, School of Mechanical Engineering, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia https://orcid.org/0000-0002-8056-4505
  • M.A.A.M. Salleh Universiti Malaysia Perlis (UniMAP), Faculty of Chemical Engineering and Technology, Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia https://orcid.org/0000-0002-9523-7558
  • M.F.H. Baser Universiti Malaysia Perlis (UniMAP), Faculty of Chemical Engineering and Technology, Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia https://orcid.org/0009-0006-1921-609X
  • N.A.I. Baharin Universiti Malaysia Perlis (UniMAP), Faculty of Chemical Engineering and Technology, Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia https://orcid.org/0009-0003-5749-8567
  • M.S.A. Aziz Universiti Sains Malaysia, School of Mechanical Engineering, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia https://orcid.org/0000-0002-3271-9242
  • M.M. Al B. Abdullah Universiti Malaysia Perlis (UniMAP), Faculty of Chemical Engineering and Technology, Center of Excellence Geopolymer & Green Technology (CeGeoGTech), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia https://orcid.org/0000-0002-9779-8586
  • M. Nabiałek Czestochowa University of Technology, Faculty of Production Engineering and Materials Technology, Department of Physics, 19 Armii Krajowej Av., 42-200 Częstochowa, Poland https://orcid.org/0000-0001-6585-3918

DOI:

https://doi.org/10.24425/amm.2025.156258

Abstract

This study investigated the impact of different amounts of bismuth (Bi) (0 wt.%, 0.5 wt.%, 1.0 wt.%, 1.5 wt.%, and 2.0 wt.%) on the microstructure and mechanical properties of Sn-0.7Cu solder, which is known for its high strength. The microstructure analysis was carried out using an optical microscope (OM). A single lap shear test was carried out to evaluate the shear strength of the solder alloys. The results demonstrated that the addition of 1.5 wt.% Bi effectively refined the formation of Cu6Sn5 intermetallic in the solder joint compared to Sn-0.7Cu/Cu joints. Additionally, the incorporation of 1.5 wt.% Bi led to a substantial increase in shear strength compared to pure Sn-0.7Cu. These findings validate the potential application of the developed material as a high-strength solder for advanced interconnecting purposes.

Published

2025-12-22

How to Cite

Zaimi, N.S.M., et al. “Impact of Bismuth As Microalloying Element in Sn-0.7Cu Lead-Free Solder Alloys”. Archives of Metallurgy and Materials, vol. 70, no. 4, Dec. 2025, doi:10.24425/amm.2025.156258.

Issue

Vol. 70 No. 4 (2025)

Section

Articles