Kwiecien, I. (2026) “Modern Rhenium-Modified Ni-P Surface Finishes: Wetting and Interfacial Reactions with Sn-3.0Ag-0.5Cu Solder under Thermal Cycling Simulation ”, Archives of Metallurgy and Materials, 71(3), pp. 737–749. doi: 10.24425/amm.2026.1963.