Editorial Team

Editorial Board (2023–2026)

Editor-in-Chief

  • A. Rogalski — Military University of Technology

Honorary (Past) Editor-in-Chief

  • T. Kaczorek — Warsaw University of Technology

  • M.P. Kaźmierkowski — Warsaw University of Technology

Deputy Editors-in-Chief

  • B. Błachowski — Institute of Fundamental Technological Research, Polish Academy of Sciences (PAN)

  • M. Mrozowski — Gdańsk University of Technology

Board of Topical Co-editors

Artificial and Computational Intelligence

  • B. Sawicki — Warsaw University of Technology

  • T. Leś — Warsaw University of Technology

Biomedical Engineering and Biotechnology

  • P. Ładyżyński — Institute of Biocybernetics and Biomedical Engineering, PAN

Civil Engineering

  • L. Czarnecki — Building Research Institute (ITB), Warsaw

  • Ł. Sadowski — Wrocław University of Science and Technology

Control, Robotics and Informatics

  • J. Klamka — Silesian Technical University

  • A. Babiarz — Silesian Technical University

  • J. Stefanowski — Poznań University of Technology

Electronics, Telecommunication and Optoelectronics

  • M. Mrozowski — Gdańsk University of Technology

  • P. Kryszkiewicz — Gdańsk University of Technology

Mechanical and Aeronautical Engineering, Thermodynamics

  • B. Błachowski — Institute of Fundamental Technological Research, PAN

  • G. Zboiński — Institute of Fluid-Flow Machinery, PAN; University of Warmia and Mazury in Olsztyn

Materials Science and Nanotechnology

  • B. Major — Institute of Metallurgy and Materials Science, PAN

  • P. Czaja — Institute of Metallurgy and Materials Science, PAN

Power Systems and Power Electronics

  • J. Rąbkowski — Warsaw University of Technology

  • M. Jasiński — Warsaw University of Technology


International Editorial Advisory Board
R. Asthana, University of Wisconsin-Stout, Menomonie, USA
Xu Binshi, China Association of Plant Engineering, Beijing, P.R. China
F. Blaabjerg, Aalborg University, Denmark
C. Cecati, University of L’Aquila, Italy
A. Cichocki, RIKEN Institute, Tokyo, Japan
M. David, National Polytechnique de Toulouse, France
R. Ebner, Materials Centre Leoben, Leoben, Austria
E. Fornasini, University of Padova, Padova, Italy
L.G. Franquelo, University of Sevilla, Spain
M. Gad-el-Hak, Virginia Commonwealth University, Richmond, USA
M. Giersig, Free University of Berlin, Germany
D. van Gemert, Catholic University Leuven, KU Leuven, Belgium
L. Keviczky, Hungarian Academy of Sciences, Budapest, Hungary
V. Kučera, Czech Technical University in Prague, Prague, Czech Republic
R. Kennel, Technical University Munich, Germany
T.A. Kowalewski, Institute of Fundamental Technological Research PAN
E. Levi, Liverpool John Moore University, UK
G. Maier, Technical University of Milan, Milan, Italy
K.F. Man, City University of Hong Kong,
R. Maniewski, Institute of Biocybernetics and Biomedical Engineering PAN
H.A. Mang, Austrian Academy of Sciences, Vienna, Austria
H. Mihashi, Tohoku University, Aoba-ku, Sendai, Japan
S. Mindess, University of British Columbia, Vancouver, Canada
D.A. Mlynski, University of Karlsruhe, Karlsruhe, Germany
A.S. Nowak, University of Michigan, Ann Arbor, USA
K. Ohnishi, Keio University, Yokohama, Japan
A. Öberg, Linköping University, Linköping, Sweden
W. Pedrycz, University of Alberta, Canada
M. Razeghi, Northwestern University, Evanston, USA
J. Rodriguez, University of Andres Bello, Santiago, Chile
J.V. Sloten, Catholic University Leuven, Leuven, Belgium
B.M. Wilamowski, University of Auburn, Alabama, USA
A.L. Yarin, University of Illinois at Chicago, USA
Du Xiangwan, Chinese Academy of Engineering, China
J. Żurada, Department of Computer Engineering, University of Louisville, USA