Thermoplastic hardened Cu-Ni-Si-Ag alloy

Abstract

The goal of the work was to investigate the influence of silver addition on the microstructure of CuNi2Si1 alloys. The investigated copper alloy was cast and then supersaturated, plastically deformed on the Gleeble 3800 simulator and finally aged. Structural changes were examined using optical microscopy, scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Orientation mapping was completed FEI Quanta 3D field emission gun scanning electron microscope (SEM) equipped with TSL electron backscattered diffraction (EBSD) system. The effect of structural and microstructural changes on hardness and conductivity was also investigated. Based on the mechanical tests it was found, that the mechanical properties and conductivity are improved due to heat and plastic treatment. It was also found that the precipitation hardening raises the hardness to the level of 40% whilst an increase in conductivity by 20% is observed.